Corrective Assignment to Correct the Omitted Assignor Names Previously Recorded on Reel 032752 Frame 0329. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.

Recorded: 2014-05-06 Pages: 3

Assignors

CHUANG, TUNG-HAN

Executed: 2014-02-10

TSAI, HSING-HUA

Executed: 2014-02-10

LEE, JUN-DER

Executed: 2014-02-10

Assignee

WIRE TECHNOLOGY CO., LTD.

NO. 27, ALY. 56, LN. 320, SEC.1, SHATIAN RD., DADU DIST., TAICHUNG CITY, 432, TAIWAN

Covered Property (1)

Stud Bump and Package Structure Thereof and Method of Manufacturing the Same

Patent: 9,425,168 →

Application: 14/256,233 →

Publication: US 2015/0194409

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.