Patent Assignment
Reel/Frame 032852/0735
Assignment of Assignor's Interest
Recorded: 2014-05-08
Pages: 6
Assignors
LIN, CHUNG-YI
Executed: 2014-04-09
YANG, JIING-FENG
Executed: 2014-04-09
KAO, KO-BIN
Executed: 2014-04-09
CHENG, YUNG-SHIH
Executed: 2014-04-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Methods of Patterning Small Via Pitch Dimensions