Patent Assignment
Reel/Frame 032868/0094
Assignment of Assignor's Interest
Recorded: 2014-05-12
Pages: 5
Assignors
CHEN, HSIEN-WEI
Executed: 2008-07-02
LIU, YU-WEN
Executed: 2008-07-02
TSAI, HAO-YI
Executed: 2008-07-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structure for Reducing Integrated Circuit Corner Peeling