Patent Assignment
Reel/Frame 032875/0392
Assignment of Assignor's Interest
Recorded: 2014-05-13
Pages: 4
Assignors
NAKAKO, HIDEO
Executed: 2014-04-22
YAMAMOTO, KAZUNORI
Executed: 2014-04-23
KUMASHIRO, YASUSHI
Executed: 2014-04-22
YOKOSAWA, SHUNYA
Executed: 2014-05-01
NOUDOU, TAKAAKI
Executed: 2014-04-23
INADA, MAKI
Executed: 2014-04-23
KURODA, KYOKO
Executed: 2014-04-23
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Composition Set, Conductive Substrate and Method of Producing the Same, and Conductive Adhesive Composition
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →