Patent Assignment
Reel/Frame 032896/0544
Assignment of Assignor's Interest
Recorded: 2014-05-15
Pages: 5
Assignor
OOKAWA, SATOSHI
Executed: 2014-04-11
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Method, Bonding Apparatus, and Bonding System