Patent Assignment
Reel/Frame 032908/0816
Assignment of Assignor's Interest
Recorded: 2014-05-16
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Method of Forming a Copper Layer Using Physical Vapor Deposition