Patent Assignment
Reel/Frame 032953/0892
Assignment of Assignor's Interest
Recorded: 2014-05-23
Pages: 2
Assignors
IDE, EIICHI
Executed: 2013-07-04
TOKUYAMA, TAKESHI
Executed: 2013-07-04
TSUYUNO, NOBUTAKE
Executed: 2013-07-04
NAKATSU, KINYA
Executed: 2013-07-04
SUWA, TOKIHITO
Executed: 2013-07-06
KANEKO, YUUJIRO
Executed: 2013-07-05
Assignee
HITACHI AUTOMOTIVE SYSTEMS, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Property
(1)
Semiconductor Module and Method for Manufacturing Semiconductor Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.