Patent Assignment
Reel/Frame 032969/0639
Assignment of Assignor's Interest
Recorded: 2014-05-27
Pages: 5
Assignees
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY
STMICROELECTRONICS (MALTA) LTD
INDUSTRIAL CENTER, INDUSTRIES ROAD, KIRKOP, ZRQ 10, MALTA
Covered Property
(1)
Wafer-Level Packaging of Integrated Devices, and Manufacturing Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.