IP Library › Assignment 060780/0065
Patent Assignment
Reel/Frame 060780/0065

Assignment of Assignor's Interest

Recorded: 2022-08-11 Pages: 5
Assignor
STMICROELECTRONICS (MALTA) LTD
Executed: 2022-07-21
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Properties (2)
Surface Mount Package for a Semiconductor Integrated Device, Related Assembly and Manufacturing Process
Patent: 9,257,372 →
Application: 14/032,075 →
Publication: US 2014/0091443
Wafer-Level Packaging of Integrated Devices, and Manufacturing Method Thereof
Patent: 9,446,943 →
Application: 14/288,130 →
Publication: US 2014/0353775
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 20, 2013
From: DUCA, ROSEANNE; GOH, KIM-YONG; ZHANG, XUEREN; FORMOSA, KEVIN
To: STMICROELECTRONICS (MALTA) LTD; STMICROELECTRONICS PTE LTD
Reel/Frame 031250/0782 →
Assignment of Assignor's Interest May 27, 2014
From: FORMOSA, KEVIN; MAGGI, LUCA
To: STMICROELECTRONICS S.R.L.; STMICROELECTRONICS (MALTA) LTD
Reel/Frame 032969/0639 →
Assignment of Assignor's Interest Jun 7, 2022
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060127/0427 →
Assignment of Assignor's Interest Jun 7, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060301/0355 →