IP Library › Assignment 031250/0782
Patent Assignment
Reel/Frame 031250/0782

Assignment of Assignor's Interest

Recorded: 2013-09-20 Pages: 4
Assignors
DUCA, ROSEANNE
Executed: 2013-08-12
GOH, KIM-YONG
Executed: 2013-08-12
ZHANG, XUEREN
Executed: 2013-08-12
FORMOSA, KEVIN
Executed: 2013-08-12
Assignees
STMICROELECTRONICS (MALTA) LTD
INDUSTRIAL CENTER, INDUSTRIES ROAD, KIRKOP, ZRQ 10, MALTA
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Surface Mount Package for a Semiconductor Integrated Device, Related Assembly and Manufacturing Process
Patent: 9,257,372 →
Application: 14/032,075 →
Publication: US 2014/0091443
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2022
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060127/0427 →
Assignment of Assignor's Interest Aug 11, 2022
From: STMICROELECTRONICS (MALTA) LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060780/0065 →