Patent Assignment
Reel/Frame 032982/0721
Assignment of Assignor's Interest
Recorded: 2014-05-21
Pages: 5
Assignors
JEONG, DONG JIN
Executed: 2014-05-02
KIM, SUNG HOON
Executed: 2014-05-02
MIN, BYUNG SEUNG
Executed: 2014-05-02
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Electronic Component and Manufacturing Method Thereof