Patent Assignment
Reel/Frame 032985/0315
Assignment of Assignor's Interest
Recorded: 2014-05-29
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including a Metal Layer Between First and Second Semiconductor Chips