Patent Assignment
Reel/Frame 032987/0872
Assignment of Assignor's Interest
Recorded: 2014-05-29
Pages: 6
Assignors
CHO, MIN-HEE
Executed: 2014-05-13
YAMADA, SATORU
Executed: 2014-05-13
SHIN, SANG-HO
Executed: 2014-05-13
LEE, SUNG-SAM
Executed: 2014-05-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device and Semiconductor Package