Patent Assignment
Reel/Frame 032991/0748
Assignment of Assignor's Interest
Recorded: 2014-05-29
Pages: 4
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Molding Composition for Semiconductor Package and Semiconductor Package Using the Same