IP Library › Assignment 032991/0957
Patent Assignment
Reel/Frame 032991/0957

Assignment of Assignor's Interest

Recorded: 2014-05-29 Pages: 3
Assignors
LAI, YING-HUA
Executed: 2014-04-28
CHANG, CHIA-MING
Executed: 2014-04-28
CHIANG, TSUNG-YU
Executed: 2014-04-28
CHEN, KUANG-HSIN
Executed: 2014-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Structures and Formation Methods of Finfet Device
Patent: 9,257,505 →
Application: 14/273,970 →
Publication: US 2015/0325646