Patent Assignment
Reel/Frame 033002/0985
Assignment of Assignor's Interest
Recorded: 2014-05-31
Pages: 4
Assignees
LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
NO. 25, GUANGPU W. RD. GUANGZHOU SCIENCE CITY, GUANGZHOU HI-TECH INDUSTRIAL DEVELOPMENT ZONE, GUANGZHOU, CHINA
LITE-ON TECHNOLOGY CORPORATION
22F., NO. 392, RUEY KUANG ROAD, NEIHU DIST., TAIPEI CITY, TAIWAN
Covered Property
(1)
Flip-Chip Light Emitting Diode Package Module and Manufacturing Method Thereof