Flip-chip light emitting diode package module and manufacturing method thereof
The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module comprises the following steps. A plurality of LEDs is disposed on a carrier. A packaging process is forming a plurality of transparent lens corresponding to LEDs and binding each other by a wing portion. A separating process is proceeding to form a plurality of flip-chip LED structures without the carrier. A bonding process is proceeding to attach at least one flip-chip LED structure on the circuit board.
1. A flip-chip LED package module, comprising:
a circuit board having an upper surface with a plurality of electrical contact pads; and
a flip-chip LED package structure, directly disposed on the circuit board, comprising:
an LED chip having a lateral surface and a first surface and a second surface opposite each other, wherein the lateral surface is adjacent to respectively the first surface and the second surface, the second surface has at least a pair of chip metalized pads, and the at least one pair of chip metalized pad has a gap; and
a transparent package, enclosing the surrounding lateral surface, the first surface, and the second surface of the LED chip, and filling the gap, wherein the transparent package has an exposed bottom surface facing the upper surface of the circuit board;
wherein the at least one pair of chip metalized pads is exposed from the bottom surface of the transparent package and is electrically connected to respective electrical contact pads, and the bottom face of the transparent package is separate from the circuit board.
2. The flip chip LED package module according to claim 1 , wherein a contact point of each of the chip metalized pad is coplanar with the bottom face of the transparent package.
3. The flip chip LED package module according to claim 1 , wherein the surface area of each of the chip metalized pads is greater than or equal to the respective surface area of the electrical contact pads.
4. The flip chip LED package module according to claim 1 , wherein the transparent package has the form of a lens, the periphery of the transparent package forms a wing portion, the thickness W of the wing portions is determined by the following formula: H 1 <W<H 2 , H 2 =R*sin θ, tan θ=H 1 /(L/2), wherein H 1 is the thickness of the LED chip, L is the dimension of the LED chip, R is the length of a line segment passing from the center point of the inner bottom face through the joint of the lateral surface and the first surface and to the surface of the transparent package, and θ is the included angle between the line of length R and the bottom face of the transparent package.
5. The flip chip LED package module according to claim 1 , further comprising a fluorescent material for adjusting lighting color positioned on the surface of the LED chip or in the transparent package.
6. The flip chip LED package module according to claim 1 , wherein the lateral surface further includes a lateral wall protection layer, the refractive index of the transparent package is substantially equal to or smaller than the refractive index of the lateral wall protection layer.
7. The flip chip LED package module according to claim 1 , wherein the flip-chip LED package structure has two opposite first sides respectively formed of two substantially flat surfaces and a top side formed of one of a substantially curved surface and a substantially semicircular surface, and the top side is connected between the two first sides.
8. The flip chip LED package module according to claim 7 , wherein the flip-chip LED package structure has two opposite second sides respectively formed of two substantially flat surfaces, the top side is connected between the two second sides, the two first sides and the two second sides are alternately connected to form a periphery of the flip-chip LED package structure .