Patent Assignment
Reel/Frame 033005/0979
Assignment of Assignor's Interest
Recorded: 2014-06-02
Pages: 4
Assignors
LIN, YU-HUNG
Executed: 2014-05-22
YEH, CHING-FU
Executed: 2014-05-22
CHANG, YU-MIN
Executed: 2014-05-22
CHOU, YOU-HUA
Executed: 2014-05-22
CHANG, CHIH-WEI
Executed: 2014-05-22
LIN, SHENG-HSUAN
Executed: 2014-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Barrier Structure for Copper Interconnect