Patent Assignment
Reel/Frame 033008/0430
Assignment of Assignor's Interest
Recorded: 2014-06-02
Pages: 3
Assignor
CHAPELON, LAURENT-LUC
Executed: 2014-02-04
Assignee
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, F-38926, FRANCE
Covered Property
(1)
Process for Fabricating a Three-Dimensional Integrated Structure with Improved Heat Dissipation, and Corresponding Three-Dimensional Integrated Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.