IP Library Assignment 060784/0143
Patent Assignment
Reel/Frame 060784/0143

Assignment of Assignor's Interest

Recorded: 2022-08-11 Pages: 10
Assignor
STMICROELECTRONICS (CROLLES 2) SAS
Executed: 2022-06-30
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Properties (27)
Image Sensor of Curved Surface
Patent: 9,099,603 →
Application: 13/858,389 →
Publication: US 2013/0270662
Stack of Semiconductor Structures and Corresponding Manufacturing Method
Patent: 8,907,481 →
Application: 13/869,072 →
Publication: US 2013/0292823
Adjustable Avalanche Diode in an Integrated Circuit
Patent: 9,018,729 →
Application: 13/895,715 →
Publication: US 2013/0328150
Input/Output Cell Design for Thin Gate Oxide Transistors with Restricted Poly Gate Orientation
Patent: 9,075,947 →
Application: 13/911,224 →
Publication: US 2014/0365987
Operating Conditions Compensation Circuit
Patent: 8,981,817 →
Application: 13/926,748 →
Publication: US 2014/0375357
Circuit for Providing a Voltage or a Current
Patent: 9,298,205 →
Application: 14/024,876 →
Publication: US 2014/0077864
Method for Depositing a Low-Diffusion Tialn Layer and Insulated Gate Comprising Such a Layer
Patent: 9,029,254 →
Application: 14/032,436 →
Publication: US 2014/0097504
Semiconductor Device Comprising a Crack Stop Structure
Patent: 8,981,551 →
Application: 14/032,618 →
Publication: US 2014/0091451
Antenna Circuit Using Multiple Independent Antennas Simultaneously Through a Single Feed
Patent: 9,379,455 →
Application: 14/058,515 →
Publication: US 2014/0145897
Integrated Structure with Improved Heat Dissipation
Patent: 9,520,334 →
Application: 14/155,007 →
Publication: US 2014/0210071
Method of Forming Interconnection Lines
Patent: 9,105,699 →
Application: 14/167,065 →
Publication: US 2014/0210105
Integrated Device of a Capacitive Type for Detecting Humidity, in Particular Manufactured Using a Cmos Technology
Patent: 9,234,859 →
Application: 14/226,554 →
Publication: US 2014/0291778
Process for Producing at Least One Through-Silicon via with Improved Heat Dissipation, and Corresponding Three-Dimensional Integrated Structure
Patent: 9,165,861 →
Application: 14/287,343 →
Publication: US 2014/0361440
Process for Fabricating a Three-Dimensional Integrated Structure with Improved Heat Dissipation, and Corresponding Three-Dimensional Integrated Structure
Patent: 9,136,233 →
Application: 14/293,341 →
Publication: US 2014/0361413
Method for Determining a Three-Dimensional Stress Field of an Object, an Integrated Structure in Particular, and Corresponding System
Patent: 9,638,589 →
Application: 14/311,497 →
Publication: US 2014/0373640
Dual Conversion Gain Image Sensor Cell
Patent: 9,590,127 →
Application: 14/335,095 →
Publication: US 2015/0021459
Oxide Capacitor Electro-Optical Phase Shifter
Patent: 9,411,176 →
Application: 14/492,435 →
Publication: US 2015/0093067
Stack of Semiconductor Structures and Corresponding Manufacturing Method
Patent: 9,093,456 →
Application: 14/519,832 →
Publication: US 2015/0054140
Optoelectronic Device, in Particular Memory Device
Patent: 9,530,489 →
Application: 14/527,166 →
Publication: US 2015/0117128
Device Comprising a Three-Dimensional Integrated Structure with Simplified Thermal Dissipation, and Corresponding Fabrication Method
Patent: 9,449,896 →
Application: 14/590,404 →
Publication: US 2015/0200151
Heat Pipe and Method of Manufacturing the Same
Patent: 9,953,895 →
Application: 14/643,837 →
Publication: US 2015/0262908
Integrated Circuit Chip Assembled on an Interposer
Patent: 9,418,954 →
Application: 14/659,680 →
Publication: US 2015/0270192
Integrated Circuit Chip Assembled on an Interposer
Patent: 9,780,015 →
Application: 15/204,488 →
Publication: US 2016/0322276
Optoelectronic Device, in Particular Memory Device
Patent: 9,536,599 →
Application: 15/249,583 →
Publication: US 2016/0372183
Methods of Fabricating Integrated Circuit Devices With Components on Both Sides of a Semiconductor Layer
Application: 15/699,707 →
Publication: US 2017/0371099
Heat Pipe and Method of Manufacturing the Same
Application: 15/816,990 →
Publication: US 2018/0076114
Methods of Fabricating Integrated Circuit Devices with Components on Both Sides of a Semiconductor Layer
Application: 16/696,086 →
Publication: US 2020/0116927
Related Assignments (23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 15, 2013
From: ROY, FRANCOIS; FIORI, VINCENT
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 030212/0037 →
Assignment of Assignor's Interest Apr 24, 2013
From: CHAPELON, LAURENT-LUC
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 030274/0574 →
Assignment of Assignor's Interest May 16, 2013
From: BIANCHI, RAUL ANDRES; FONTENEAU, PASCAL
To: STMICROELECTRONICS (CROLLES 2) SAS; STMICROELECTRONICS SA
Reel/Frame 030429/0387 →
Assignment of Assignor's Interest Jun 25, 2013
From: DAUTRICHE, PIERRE
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 030684/0628 →
Assignment of Assignor's Interest Jun 25, 2013
From: KUMAR, VINOD; BADRATHWAL, PRADEEP KUMAR; RIZVI, SAIYID MOHAMMAD IRSHAD; GARG, PARAS
To: STMICROELECTRONICS PVT LTD
Reel/Frame 030685/0752 →
Assignment of Assignor's Interest Jul 2, 2013
From: STMICROELECTRONICS PVT LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 030726/0223 →
Assignment of Assignor's Interest Jul 2, 2013
From: KUMAR, MANOJ; GUILLORIT, JEAN; DAYANI, NAVIN KUMAR
To: STMICROELECTRONICS (CROLLES 2) SAS; STMICROELECTRONICS PVT LTD
Reel/Frame 030726/0187 →
Assignment of Assignor's Interest Sep 12, 2013
From: BIANCHI, RAUL ANDRES
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 031191/0907 →
Assignment of Assignor's Interest Sep 20, 2013
From: CAUBET, PIERRE; DOMENGIE, FLORIAN; BAUDOT, SYLVAIN
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 031248/0609 →
Assignment of Assignor's Interest Sep 23, 2013
From: DELPECH, PHILIPPE; SABOURET, ERIC; GALLOIS-GARREIGNOT, SEBASTIEN
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 031259/0077 →
Assignment of Assignor's Interest Oct 21, 2013
From: SONNERAT, FLORENCE; PILARD, ROMAIN; GIANESELLO, FREDERIC; DURAND, CEDRIC
To: STMICROELECTRONICS SA; STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 031443/0652 →
Assignment of Assignor's Interest Jan 14, 2014
From: CHAPELON, LAURENT-LUC; ANCEY, PASCAL; LHOSTIS, SANDRINE
To: STMICROELECTRONICS SA; STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 031966/0468 →
Assignment of Assignor's Interest Jan 22, 2014
From: STMICROELECTRONICS PVT LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 032020/0217 →
Assignment of Assignor's Interest Jan 29, 2014
From: FARYS, VINCENT
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 032077/0334 →
Assignment of Assignor's Interest Mar 26, 2014
From: VAIANA, MICHELE; CASELLA, DANIELE; BRUNO, GIUSEPPE; CARIOLA, ROSARIO
To: STMICROELECTRONICS S.R.L.; STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 032534/0132 →
Assignment of Assignor's Interest May 28, 2014
From: BAR, PIERRE; GOUSSEAU, SIMON; BEILLIARD, YANN
To: STMICROELECTRONICS SA; STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 032974/0885 →
Assignment of Assignor's Interest Jun 2, 2014
From: CHAPELON, LAURENT-LUC
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 033008/0430 →
Assignment of Assignor's Interest Jun 24, 2014
From: FIORI, VINCENT; GALLOIS-GARREIGNOT, SEBASTIEN
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 033169/0375 →
Assignment of Assignor's Interest Jun 24, 2014
From: BAR, PIERRE
To: STMICROELECTRONICS SA
Reel/Frame 033169/0285 →
Assignment of Assignor's Interest Sep 22, 2014
From: MANOUVRIER, JEAN-ROBERT; BOEUF, FREDERIC
To: STMICROELECTRONICS (CROLLES 2) SAS; STMICROELECTRONICS SA
Reel/Frame 033788/0495 →
Assignment of Assignor's Interest Aug 6, 2015
From: ROY, FRANCOIS
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 036270/0810 →
Assignment of Assignor's Interest Jun 7, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060301/0355 →
Assignment of Assignor's Interest Jul 11, 2022
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060620/0769 →