Integrated circuit chip assembled on an interposer

1. A method, comprising:

forming a plurality of conductive pads on an interposer;

depositing a biasing metal layer on an upper surface of the interposer;

depositing a masking layer on the biasing metal layer;

etching through the masking layer to form openings at locations corresponding to locations of the conductive pads;

electrolytically growing on the biasing metal layer and in the openings metal connection elements;

removing the masking layer; and

etching the biasing metal layer using the metal connection elements as an etch mask, wherein etching the biasing metal layer reveals the upper surface of the interposer.

2. The method of claim 1 , further comprising mounting an integrated circuit chip to the interposer by soldering chip connection elements to said metal connection elements.

3. The method of claim 2 , further comprising filling a free space between the integrated circuit chip and the interposer with an electrically-insulating material.

4. The method of claim 3 , further comprising depositing an insulating layer surrounding the integrated circuit chip.

5. The method of claim 4 , further comprising forming thermally-conductive vias extending through the insulating layer to make contact with a conductive line of said interposer.

6. The method of claim 4 , further comprising: polishing an upper surface of the insulating layer; and

assembling a heat sink on the polished upper surface.

7. A method, comprising:

depositing a biasing metal layer on an upper surface of an interposer;

depositing a masking layer on the biasing metal layer;

etching through the masking layer to form a trench extending along a length of the interposer;

electrolytically growing on the biasing metal layer and in the trench a metal line;

removing the masking layer; and

etching the biasing metal layer using the metal line as an etch mask, wherein etching the biasing metal layer reveals the upper surface of the interposer.

8. The method of claim 7 , further comprising mounting an integrated circuit chip to the interposer by soldering a chip connection element to said metal line.

9. The method of claim 8 , further comprising filling a free space between the integrated circuit chip and the interposer with an electrically-insulating material.

10. The method of claim 9 , further comprising depositing an insulating layer surrounding the integrated circuit chip.

11. The method of claim 10 , further comprising forming thermally-conductive vias extending through the insulating layer to make contact with an end of said metal line which projects out beyond an edge of the integrated circuit chip.

12. The method of claim 10 , further comprising: polishing an upper surface of the insulating layer; and

assembling a heat sink on the polished upper surface.

13. A method, comprising:

forming conductive pads on an interposer;

depositing a biasing metal layer on an upper surface of the interposer;

depositing a masking layer on the biasing metal layer;

etching through the masking layer to form openings in front of the conductive pads and to form trenches;

dipping the interposer into an electrolytic bath comprising metal ions and applying a voltage between the biasing metal layer and an electrode dipped into the electrolytic bath to grow elements of connection in the openings and grow metal lines in the trenches;

removing the masking layer; and

etching the biasing metal layer using the elements of connection and metal lines as an etch mask, wherein etching the biasing metal layer reveals the upper surface of the interposer.

14. The method claim 13 , further comprising:

assembling an integrated circuit chip to the interposer by soldering the integrated circuit chip to said elements of connection; and

filling a free space between the integrated circuit chip and the interposer with an electrically-insulating material.

15. The method of claim 13 , further comprising:

assembling an integrated circuit chip to the interposer by soldering the integrated circuit chip to said elements of connection; and

depositing an insulating layer to surround the integrated circuit chip.

16. The method of claim 15 , further comprising forming thermally-conductive vias extending through the insulating layer, the thermally-conductive vias being connected to ends of the metal lines.

17. The method of claim 13 , wherein said trenches comprise flared ends.

18. The method of claim 16 , further comprising:

polishing an upper surface of the insulating layer; and

assembling a heat sink on the polished upper surface of the insulating layer.

19. The method of claim 13 , wherein the metal ions of the electrolytic bath are copper ions.

20. A method, comprising:

forming a plurality of conductive pads, each conductive pad having an upper surface disposed coplanar with an upper surface of an interposer;

depositing a biasing metal layer on the upper surfaces of the interposer and the plurality of conductive pads;

depositing a masking layer on the biasing metal layer;

etching through the masking layer to form openings at locations corresponding to the plurality of conductive pads;

electrolytically growing metal connection elements on the biasing metal layer and in the openings;

removing the masking layer; and

etching the biasing metal layer using the metal connection elements as an etch mask, wherein etching the biasing metal layer reveals the upper surface of the interposer.

21. The method of claim 20 wherein the upper surface of the interposer is an upper surface of a passivation layer, and wherein etching the biasing metal layer reveals the upper surface of the passivation layer.