IP Library › Assignment 032974/0885
Patent Assignment
Reel/Frame 032974/0885

Assignment of Assignor's Interest

Recorded: 2014-05-28 Pages: 7
Assignors
BAR, PIERRE
Executed: 2014-03-17
GOUSSEAU, SIMON
Executed: 2014-03-07
BEILLIARD, YANN
Executed: 2014-03-07
Assignees
STMICROELECTRONICS SA
29, BOULEVARD ROMAIN ROLLAND, MONTROUGE, F-92120, FRANCE
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, F-38926, FRANCE
Covered Property (1)
Process for Producing at Least One Through-Silicon via with Improved Heat Dissipation, and Corresponding Three-Dimensional Integrated Structure
Patent: 9,165,861 →
Application: 14/287,343 →
Publication: US 2014/0361440
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2022
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060620/0769 →
Assignment of Assignor's Interest Aug 11, 2022
From: STMICROELECTRONICS (CROLLES 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060784/0143 →