IP Library › Assignment 031966/0468
Patent Assignment
Reel/Frame 031966/0468

Assignment of Assignor's Interest

Recorded: 2014-01-14 Pages: 5
Assignors
CHAPELON, LAURENT-LUC
Executed: 2014-01-13
ANCEY, PASCAL
Executed: 2014-01-14
LHOSTIS, SANDRINE
Executed: 2014-01-13
Assignees
STMICROELECTRONICS SA
29, BOULEVARD ROMAIN ROLLAND, MONTROUGE, F-92120, FRANCE
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, F-38926, FRANCE
Covered Property (1)
Integrated Structure with Improved Heat Dissipation
Patent: 9,520,334 →
Application: 14/155,007 →
Publication: US 2014/0210071
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2022
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060620/0769 →
Assignment of Assignor's Interest Aug 11, 2022
From: STMICROELECTRONICS (CROLLES 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060784/0143 →