Patent Assignment
Reel/Frame 033011/0568
Assignment of Assignor's Interest
Recorded: 2014-06-02
Pages: 5
Assignors
JENG, SHIN-PUU
Executed: 2014-04-14
HOU, SHANG-YUN
Executed: 2014-04-14
CHEN, KIM HONG
Executed: 2014-05-23
HUNG, WENSEN
Executed: 2014-04-14
HUANG, SZU-PO
Executed: 2014-04-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
3D Semiconductor Package Interposer with Die Cavity