Patent Assignment
Reel/Frame 033059/0004
Assignment of Assignor's Interest
Recorded: 2014-06-09
Pages: 6
Assignors
JANG, YOUNGJUN
Executed: 2014-04-29
AHN, BONG-SU
Executed: 2014-04-18
JEONG, JIN-SU
Executed: 2014-04-18
CHOI, JUGNSIK
Executed: 2014-04-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad Compound