Polishing pad compound
A polishing pad compound and a polishing pad, the polishing pad compound including a pre-polymer; and a hardener, wherein the pre-polymer includes about 45 wt % to about 50 wt % of a polyol, about 5 wt % to about 25 wt % of a hardness regulator, and a balance of an isocyanate.
1. A polishing pad compound, comprising:
a pre-polymer; and
a methylenebis(2-chloroaniline) hardener,
wherein the pre-polymer includes:
45 wt % to 50 wt % of a polyol, the polyol being a 1:1:1 mixture of poly tetramethylene glycol, poly ethylene glycol, and poly propylene glycol,
5 wt % to 25 wt % of a hardness regulator, and
a balance of an isocyanate, and
wherein the pre-polymer and the methylenebis(2-chloroaniline) are mixed in an equivalent weight ratio of 1:1.
2. The polishing pad compound as claimed in claim 1 , wherein the polyol has a molecular mass of 1,000 or higher.
3. The polishing pad compound as claimed in claim 1 , wherein the hardness regulator includes dicyclohexylmethane-4,4′-diisocyanate.
4. The polishing pad compound as claimed in claim 1 , wherein the isocyanate includes toluene diisocyanate.
5. The polishing pad compound as claimed in claim 1 , wherein the pre-polymer includes 9.0 wt % to 9.5 wt % of a —N═C═O group.
6. The polishing pad compound as claimed in claim 1 , wherein the polishing pad compound has a shore-D hardness of 70 to 75.
7. A polishing pad prepared using the polishing pad compound as claimed in claim 1 .
8. The polishing pad as claimed in claim 7 , wherein:
the polyol of the polishing pad compound forms a soft segment in the polishing pad,
the isocyanate forms a hard segment in the polishing pad, and
the hardness regulator is included between hard segments in the polishing pad.