Patent Assignment
Reel/Frame 033062/0100
Assignment of Assignor's Interest
Recorded: 2014-05-29
Pages: 2
Assignor
CHUNG, QWAN HO
Executed: 2014-04-23
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON, 467-734, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Emi Shielding and Method of Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.