IP Library Assignment 033062/0175
Patent Assignment
Reel/Frame 033062/0175

Assignment of Assignor's Interest

Recorded: 2014-05-29 Pages: 3
Assignors
LEE, CHIA-YEN
Executed: 2014-04-03
LIN, CHI-CHENG
Executed: 2014-04-03
TSAI, HSIN-CHANG
Executed: 2014-04-03
Assignee
DELTA ELECTRONICS, INC.
252, SHANG YING ROAD, KUEI SAN, TAOYUAN HSIEN, 333, TAIWAN
Covered Property (1)
Wafer-Level Chip Scale Package
Patent: 9,184,111 →
Application: 14/290,719 →
Publication: US 2015/0129892
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 8, 2022
From: DELTA ELECTRONICS, INC.
To: ANCORA SEMICONDUCTORS INC.
Reel/Frame 061695/0106 →