IP Library Assignment 061695/0106
Patent Assignment
Reel/Frame 061695/0106

Assignment of Assignor's Interest

Recorded: 2022-11-08 Pages: 5
Assignor
DELTA ELECTRONICS, INC.
Executed: 2022-10-19
Assignee
ANCORA SEMICONDUCTORS INC.
6F, NO. 252, SHANYING RD., GUISHAN DIST., TAOYUAN CITY, 333425, TAIWAN
Covered Properties (37)
Interconnection Structure Having a via Structure
Patent: 9,159,699 →
Application: 13/675,297 →
Publication: US 2014/0131871
Interconnection Structure of Package Structure and Method of Forming the Same
Patent: 9,209,164 →
Application: 14/020,045 →
Publication: US 2014/0131887
Method of Forming Interconnection Structure of Package Structure
Patent: 9,275,982 →
Application: 14/591,551 →
Publication: US 2015/0125995
Interconnection Structure Having a via Structure and Fabrication Thereof
Application: 14/748,811 →
Publication: US 2015/0294910
Wafer-Level Chip Scale Package
Patent: 9,184,111 →
Application: 14/290,719 →
Publication: US 2015/0129892
Power Semiconductor Device and Method for Fabricating the Same
Patent: 9,425,308 →
Application: 14/144,999 →
Publication: US 2015/0187932
Semiconductor Device
Patent: 9,184,251 →
Application: 14/165,988 →
Publication: US 2015/0091095
Semiconductor Device
Patent: 9,236,438 →
Application: 14/707,810 →
Publication: US 2015/0243744
Embedded Packaging Device
Patent: 9,177,957 →
Application: 14/516,169 →
Power Module Package Having Patterned Insulation Metal Substrate
Patent: 9,905,439 →
Application: 15/142,458 →
Publication: US 2017/0316955
Power Module Package Having Patterned Insulation Metal Substrate
Patent: 9,865,531 →
Application: 15/142,588 →
Publication: US 2017/0317014
Power Module Package Having Patterned Insulation Metal Substrate
Application: 15/484,714 →
Publication: US 2017/0317015
Waveform Conversion Circuit for Gate Driver
Application: 15/203,468 →
Publication: US 2018/0013413
Waveform Conversion Circuit for Gate Driver
Application: 16/151,829 →
Publication: US 2019/0036519
Waveform Conversion Circuit for Gate Driver
Application: 16/417,092 →
Publication: US 2019/0273491
Waveform Conversion Circuit for Gate Driver
Application: 16/422,820 →
Publication: US 2019/0280685
Waveform Conversion Circuit for Gate Driver
Application: 16/904,976 →
Publication: US 2020/0321958
Package Structures
Application: 15/283,963 →
Publication: US 2018/0096921
Semiconductor Devices with via Structure and Package Structures Comprising the Same
Application: 15/358,469 →
Publication: US 2018/0145018
Driving Circuit of a Power Circuit
Patent: 9,906,221 →
Application: 15/395,738 →
Driving Circuit of a Power Circuit
Application: 15/494,955 →
Publication: US 2018/0191342
Driving Circuit of a Power Circuit and a Regulator
Application: 15/495,009 →
Publication: US 2018/0191244
Driving Circuit of a Power Circuit
Application: 15/894,561 →
Publication: US 2018/0191245
Driving Circuit of a Power Circuit
Application: 16/167,041 →
Publication: US 2019/0058469
Driving Circuit and a Desaturation Circuit of a Power Circuit
Application: 16/403,321 →
Publication: US 2019/0260373
Driving Circuit and an Under-Voltage Lockout Circuit of a Power Circuit
Application: 16/403,369 →
Publication: US 2019/0260374
Driving Circuit of a Power Circuit and a Package Structure Thereof
Application: 16/403,396 →
Publication: US 2019/0260375
Enclosed Gate Runner for Eliminating Miller Turn-On
Application: 15/655,241 →
Publication: US 2019/0027593
Enclosed Gate Runner for Eliminating Miller Turn-On
Application: 16/213,081 →
Publication: US 2019/0109221
Package Structures and Methods for Fabricating the Same
Application: 16/050,428 →
Publication: US 2020/0043881
Package Structures
Application: 16/574,478 →
Waveform Conversion Circuit for Gate-Driving Circuit
Application: 17/148,012 →
Publication: US 2021/0226621
Self-Driven Gate-Driving Circuit
Application: 17/155,914 →
Publication: US 2021/0226623
Over-Current Protection Circuit for Power Circuit
Application: 17/155,957 →
Publication: US 2021/0226443
Package Structures
Application: 17/081,546 →
Publication: US 2021/0249338
Package Structures
Application: 17/011,251 →
Package Structures
Application: 17/718,534 →
Publication: US 2023/0326918
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 15, 2012
From: TSAI, HSIN-CHANG; LEE, CHIA-YEN
To: DELTA ELECTRONICS, INC.
Reel/Frame 029303/0066 →
Assignment of Assignor's Interest Sep 13, 2013
From: LEE, CHIA-YEN; TSAI, HSIN-CHANG; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 031202/0181 →
Assignment of Assignor's Interest Dec 31, 2013
From: LIN, LI-FAN; LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 031862/0806 →
Assignment of Assignor's Interest Jan 28, 2014
From: LIN, LI-FAN; CHEN, HSUAN-WEN
To: DELTA ELECTRONICS, INC.
Reel/Frame 032064/0784 →
Assignment of Assignor's Interest May 29, 2014
From: LEE, CHIA-YEN; LIN, CHI-CHENG; TSAI, HSIN-CHANG
To: DELTA ELECTRONICS, INC.
Reel/Frame 033062/0175 →
Assignment of Assignor's Interest Nov 17, 2014
From: LEE, PENG HSIN; TSAI, HSIN CHANG; LEE, CHIA YEN
To: DELTA ELECTRONICS, INC.
Reel/Frame 034188/0339 →
Corrective Assignment to Correct the Conveying Party Data Previously Recorded at Reel: 029303 Frame: 0066. Assignor(S) Hereby Confirms the Assignment. Jul 2, 2015
From: TSAI, HSIN-CHANG; LEE, CHIA-YEN; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 036051/0748 →
Assignment of Assignor's Interest May 2, 2016
From: TSAI, HSIN-CHANG; LEE, CHIA-YEN; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 038435/0402 →
Assignment of Assignor's Interest May 2, 2016
From: TSAI, HSIN-CHANG; LEE, CHIA-YEN; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 038435/0334 →
Assignment of Assignor's Interest Jul 8, 2016
From: CHUANG, PO-CHIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 039294/0571 →
Assignment of Assignor's Interest Apr 12, 2017
From: LEE, CHIA-YEN; TSAI, HSIN-CHANG; LEE, PENG-HSIN; LIN, SHIAU-SHI
To: DELTA ELECTRONICS, INC.
Reel/Frame 041985/0285 →
Assignment of Assignor's Interest Oct 24, 2018
From: HU, CHIH-I; CHUANG, PO-CHIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 047302/0521 →
Assignment of Assignor's Interest May 29, 2019
From: HU, CHIH-I; CHUANG, PO-CHIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 049307/0138 →
Assignment of Assignor's Interest Jul 16, 2025
From: ANCORA SEMICONDUCTORS, INC.
To: MARE INFINITUS TECHNOLOGIES LLC
Reel/Frame 071720/0332 →