IP Library Granted Patent US 9,184,251
Granted Patent B2
US 9,184,251 · App. 14/165,988 · Granted Nov 10, 2015

Semiconductor device

Inventors: Li-Fan Lin (Taoyuan Hsien, TW); Hsuan-Wen Chen (Yaoyuan Hsien, TW)
Assignee: DELTA ELECTRONCIS, INC.
H01L29/4238H01L27/088H01L29/0696H01L29/2003H01L29/41758H01L29/7787H01L29/78
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Quick Facts
Patent No.
US 9,184,251
App. No.
14/165,988
Granted
Nov 10, 2015
Kind
B2
Abstract

A semiconductor device includes a substrate and a plurality of transistors arranged on the substrate in an array. The transistor includes a first electrode, a plurality of second electrodes, and a gate electrode. The second electrodes are arranged around the first electrode. The gate electrode is located between the first electrode and the second electrodes. The first electrode is a circle or polygon. The gate electrode is around the first electrode, and an edge of the gate electrode facing the first electrode has a shape corresponding to that of the first electrode.

Claims (11)

1. A semiconductor device, comprising:

a substrate;

an active layer, disposed on the substrate;

a protective layer, disposed on the active layer, having a plurality of first openings, a plurality of second openings, and a plurality of third openings, wherein each of the first openings is a circle or polygon, and the polygon is at least pentagonal, each of the second openings is around one of the first openings, an edge of each of the second openings facing the first opening therein has a shape corresponding to that of the first opening, and the third openings are located between the second openings;

a plurality of drain electrodes respectively located in the first openings;

a gate electrode comprising a first portion and a second portion connected to the first portion, wherein the first portion is located in the second openings, and the second portion is disposed on the first portion and the protective layer; and

a plurality of source electrodes respectively located in the third openings.

2. The semiconductor device as claimed in claim 1 , wherein the first opening is arranged in an array, each of the second openings is located between one of the first openings and some of the third openings.

3. The semiconductor device as claimed in claim 1 , further comprising an insulation layer disposed on the protective layer, the gate electrode, the source electrodes and the drain electrodes.

4. The semiconductor device as claimed in claim 1 , further comprising a first conduction layer connected to one of the drain electrodes, and a second conduction layer connected to the source electrodes.

5. The semiconductor device as claimed in claim 1 , wherein edges of the third openings facing the second openings correspond to the shape of the second openings.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2022
From: DELTA ELECTRONICS, INC.
To: ANCORA SEMICONDUCTORS INC.
Reel/Frame 061695/0106 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2014
From: LIN, LI-FAN; CHEN, HSUAN-WEN
To: DELTA ELECTRONICS, INC.
Reel/Frame 032064/0784 →
Priority Claims (1)
TW 102135485 A · Sep 30, 2013 · national
Continuity (1)
Related Publication 20150091095A1 · Apr 2, 2015