IP Library › Assignment 031202/0181
Patent Assignment
Reel/Frame 031202/0181

Assignment of Assignor's Interest

Recorded: 2013-09-13 Pages: 3
Assignors
LEE, CHIA-YEN
Executed: 2013-07-10
TSAI, HSIN-CHANG
Executed: 2013-07-10
LEE, PENG-HSIN
Executed: 2013-07-10
Assignee
DELTA ELECTRONICS, INC.
252, SHANG YING ROAD, KUEI SAN, TAOYUAN HSIEN, 333, TAIWAN
Covered Property (1)
Interconnection Structure of Package Structure and Method of Forming the Same
Patent: 9,209,164 →
Application: 14/020,045 →
Publication: US 2014/0131887
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 8, 2022
From: DELTA ELECTRONICS, INC.
To: ANCORA SEMICONDUCTORS INC.
Reel/Frame 061695/0106 →
Assignment of Assignor's Interest Jul 16, 2025
From: ANCORA SEMICONDUCTORS, INC.
To: MARE INFINITUS TECHNOLOGIES LLC
Reel/Frame 071720/0332 →