Patent Assignment
Reel/Frame 071720/0332
Assignment of Assignor's Interest
Recorded: 2025-07-16
Pages: 6
Assignor
ANCORA SEMICONDUCTORS, INC.
Executed: 2025-06-05
Assignee
MARE INFINITUS TECHNOLOGIES LLC
17330 PRESTON ROAD, STE200D, DALLAS, TEXAS, 75252
Covered Properties
(4)
Semiconductor Component Having a Lateral Semiconductor Device and a Vertical Semiconductor Device
Interconnection Structure of Package Structure and Method of Forming the Same
Semiconductor Device
Method of Forming Interconnection Structure of Package Structure
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 28, 2013
From: TSAI, HSIN-CHANG; LEE, CHIA-YEN; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 030711/0567 →
Assignment of Assignor's Interest
Sep 13, 2013
From: LEE, CHIA-YEN; TSAI, HSIN-CHANG; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 031202/0181 →
Assignment of Assignor's Interest
May 30, 2014
From: TSAI, HSIN-CHANG; LEE, CHIA-YEN; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 032997/0206 →
Assignment of Assignor's Interest
Nov 3, 2022
From: DELTA ELECTRONICS, INC.
To: ANCORA SEMICONDUCTORS INC.
Reel/Frame 061648/0861 →
Assignment of Assignor's Interest
Nov 8, 2022
From: DELTA ELECTRONICS, INC.
To: ANCORA SEMICONDUCTORS INC.
Reel/Frame 061695/0106 →
Assignment of Assignor's Interest
Jun 24, 2026
From: MARE INFINITUS TECHNOLOGIES LLC
To: KADESH VENTURES LLC
Reel/Frame 075068/0809 →
Assignment of Assignor's Interest
Aug 6, 2026
From: KADESH VENTURES LLC
To: MARE INFINITUS TECHNOLOGIES LLC
Reel/Frame 075552/0014 →