IP Library Assignment 061648/0861
Patent Assignment
Reel/Frame 061648/0861

Assignment of Assignor's Interest

Recorded: 2022-11-03 Pages: 5
Assignor
DELTA ELECTRONICS, INC.
Executed: 2022-10-19
Assignee
ANCORA SEMICONDUCTORS INC.
6F., NO. 252, SHANYING RD., GUISHAN DIST., TAOYUAN CITY, 333425, TAIWAN
Covered Properties (22)
Semiconductor Component Having a Lateral Semiconductor Device and a Vertical Semiconductor Device
Patent: 9,385,070 →
Application: 13/930,817 →
Publication: US 2015/0001692
Embedded Package Structure and Method for Manufacturing Thereof
Patent: 8,912,663 →
Application: 13/930,949 →
Publication: US 2015/0001727
Semiconductor Device
Patent: 9,484,418 →
Application: 14/083,777 →
Publication: US 2014/0138701
Semiconductor Device
Patent: 8,957,493 →
Application: 14/185,322 →
Publication: US 2015/0069404
Semiconductor Device
Patent: 9,431,327 →
Application: 14/291,563 →
Publication: US 2015/0348889
Semiconductor Device and Cascode Circuit
Patent: 9,325,308 →
Application: 14/291,654 →
Publication: US 2015/0349771
Low Parasitic Capacitance Semiconductor Device Package
Patent: 9,190,393 →
Application: 14/333,795 →
Publication: US 2015/0340344
Heterojunction Semiconductor Device for Reducing Parasitic Capacitance
Patent: 9,508,843 →
Application: 14/496,471 →
Publication: US 2015/0243657
Packaging Device and Manufacturing Method Thereof
Application: 14/549,996 →
Publication: US 2016/0148855
Semiconductor Device
Patent: 9,324,819 →
Application: 14/555,056 →
Transistor with Oxidized Cap Layer
Patent: 9,793,370 →
Application: 14/721,796 →
Publication: US 2015/0349107
Semiconductor Device and Manufacturing Method Thereof
Application: 14/724,963 →
Publication: US 2015/0357422
Semiconductor Device
Patent: 9,502,548 →
Application: 14/851,218 →
Semiconductor Device
Patent: 9,754,932 →
Application: 14/933,059 →
Publication: US 2017/0025406
Low Miller Factor Semiconductor Device
Patent: 9,793,390 →
Application: 14/955,481 →
Publication: US 2016/0372557
Semiconductor Device
Patent: 9,893,015 →
Application: 15/086,556 →
Publication: US 2017/0092642
Package Structure
Patent: 9,847,312 →
Application: 15/157,896 →
Publication: US 2017/0092570
Method of Manufacturing a Transistor with Oxidized Cap Layer
Patent: 9,755,044 →
Application: 15/176,446 →
Publication: US 2016/0284816
Semiconductor Device Manufacturing Method
Application: 16/262,352 →
Publication: US 2019/0172915
Package Structure and Method for Fabricating the Same
Application: 16/262,421 →
Publication: US 2020/0243453
Manufacturing Method of Packaging Device
Application: 16/856,797 →
Publication: US 2020/0251405
Semiconductor Device Manufacturing Method
Application: 17/038,693 →
Publication: US 2021/0013312
Related Assignments (21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 28, 2013
From: TSAI, HSIN-CHANG; LEE, CHIA-YEN; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 030711/0567 →
Assignment of Assignor's Interest Jun 28, 2013
From: LEE, CHIA-YEN; TSAI, HSIN-CHANG; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 030712/0291 →
Assignment of Assignor's Interest Nov 21, 2013
From: HUANG, CHI-HSING; TSAI, MING-WEI; SHIUE, CHING-CHUAN; CHUANG, PO-CHIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 031649/0815 →
Assignment of Assignor's Interest Feb 20, 2014
From: LIN, LI-FAN; LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 032257/0874 →
Assignment of Assignor's Interest May 30, 2014
From: TSAI, HSIN-CHANG; LEE, CHIA-YEN; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 032997/0206 →
Assignment of Assignor's Interest Jul 17, 2014
From: LIN, LI-FAN; LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 033333/0193 →
Assignment of Assignor's Interest Jul 29, 2014
From: LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 033414/0266 →
Assignment of Assignor's Interest Sep 25, 2014
From: LIN, LI-FAN; YANG, CHUN-CHIEH; LIAO, WEN-CHIA; SHIUE, CHING-CHUAN
To: DELTA ELECTRONICS, INC.
Reel/Frame 033819/0565 →
Assignment of Assignor's Interest Nov 21, 2014
From: TSAI, HSIN-CHANG; LEE, CHIA-YEN; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 034230/0269 →
Assignment of Assignor's Interest Nov 26, 2014
From: LIN, LI-FAN; CHEN, SHIH-PENG
To: DELTA ELECTRONICS, INC.
Reel/Frame 034272/0257 →
Assignment of Assignor's Interest May 26, 2015
From: LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 035771/0815 →
Assignment of Assignor's Interest May 29, 2015
From: LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 035740/0558 →
Assignment of Assignor's Interest Sep 11, 2015
From: LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 036540/0664 →
Assignment of Assignor's Interest Nov 5, 2015
From: LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 036965/0907 →
Assignment of Assignor's Interest Dec 1, 2015
From: LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 037179/0025 →
Assignment of Assignor's Interest Mar 31, 2016
From: LIN, LI-FAN; YANG, CHUN-CHIEH
To: DELTA ELECTRONICS, INC.
Reel/Frame 038156/0598 →
Assignment of Assignor's Interest May 18, 2016
From: TSAI, HSIN-CHANG; LEE, PENG-HSIN
To: DELTA ELECTRONICS, INC.
Reel/Frame 038745/0752 →
Assignment of Assignor's Interest Jun 8, 2016
From: LIAO, WEN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 038914/0464 →
Assignment of Assignor's Interest Jul 16, 2025
From: ANCORA SEMICONDUCTORS, INC.
To: MARE INFINITUS TECHNOLOGIES LLC
Reel/Frame 071720/0332 →
Assignment of Assignor's Interest Jun 24, 2026
From: MARE INFINITUS TECHNOLOGIES LLC
To: KADESH VENTURES LLC
Reel/Frame 075068/0809 →
Assignment of Assignor's Interest Aug 6, 2026
From: KADESH VENTURES LLC
To: MARE INFINITUS TECHNOLOGIES LLC
Reel/Frame 075552/0014 →