Manufacturing method of packaging device
A packaging device including a first semiconductor device, a thermal dissipating component, an encapsulation layer, a via, and a pad. The first semiconductor device includes a substrate, an active region, and an electrode. The active region is disposed between the substrate and the electrode. The substrate has a first surface opposite to the active region, and the electrode has a second surface opposite to the active region. The thermal dissipating component is disposed on the first surface of the substrate. The encapsulation layer encloses the second surface of the electrode and a part of the thermal dissipating component, such that another part of the thermal dissipating component is exposed by the encapsulation layer. The pad is disposed on the encapsulation layer. The via is disposed in the encapsulation layer and connects the pad to the electrode.
1. A method for manufacturing a packaging device, comprising:
providing a thermal dissipating component, wherein the thermal dissipating component comprises a first portion and a second portion separated from each other;
fixing a first surface of a first semiconductor device on or above the thermal dissipating component, wherein the first semiconductor device is formed on the first portion;
forming a second semiconductor device on the second portion;
covering the thermal dissipating component the first semiconductor device, and the second semiconductor device by an encapsulation layer, wherein the encapsulation layer encloses the second portion of the thermal dissipating component and the first portion of the thermal dissipating component is exposed by the encapsulation layer;
forming a through hole in the encapsulation layer to expose a portion of a second surface of the first semiconductor device, wherein the second surface is opposite to the first surface; and
forming a via in the through hole and a pad on the via.
2. The method of claim 1 , wherein the through hole is performed using photolithography process, laser drilling process, or mechanical machining process.
3. The method of claim 1 , wherein the via and the pad are performed using copper electroplating process.
4. The method of claim 1 , further comprising:
forming a solder between the first semiconductor device and the thermal dissipating component.
5. The method of claim 4 , wherein the solder is made from metal.
6. The method of claim 1 , wherein fixing the first semiconductor device on or above the thermal dissipating component comprises:
fixing the first semiconductor device in a cavity of the thermal dissipating component.
7. The method of claim 1 , further comprising:
forming a third semiconductor device to be electrically connected to the first portion and the second portion of the thermal dissipating component.