Patent Assignment
Reel/Frame 033064/0270
Assignment of Assignor's Interest
Recorded: 2014-06-10
Pages: 4
Assignors
LIU, PING-YIN
Executed: 2014-05-22
CHU, YEN-CHANG
Executed: 2014-05-22
HUANG, XIN-HUA
Executed: 2014-05-22
CHAO, LAN-LIN
Executed: 2014-05-22
TU, YEUR-LUEN
Executed: 2014-05-22
LEE, RU-LIANG
Executed: 2014-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Apparatus and Method for Wafer Level Bonding