Patent Assignment
Reel/Frame 033064/0309
Assignment of Assignor's Interest
Recorded: 2014-06-10
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-05-26
WU, CHI-HSI
Executed: 2014-05-26
CHIOU, WEN-CHIH
Executed: 2014-05-26
LEE, HSIANG-FAN
Executed: 2014-05-26
TAI, SHIH-PENG
Executed: 2014-05-26
CHIU, TANG-JUNG
Executed: 2014-05-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Methods of Forming Integrated Circuit Package