Patent Assignment
Reel/Frame 033093/0703
Assignment of Assignor's Interest
Recorded: 2014-06-12
Pages: 5
Assignors
HUANG, SHIH-MING
Executed: 2014-06-10
LIN, CHUN-HUNG
Executed: 2014-06-10
CHEN, YI-TING
Executed: 2014-06-10
LIN, WEN-HSIN
Executed: 2014-06-10
CHAN, SHIH-WEI
Executed: 2014-06-10
CHANG, YUNG-HSING
Executed: 2014-06-10
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Semiconductor Process