Patent Assignment
Reel/Frame 033094/0940
Assignment of Assignor's Interest
Recorded: 2014-06-13
Pages: 4
Assignor
PARK, JE-MIN
Executed: 2014-06-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Semiconductor Devices Including Interlayer Wiring Structures