IP Library › Assignment 033095/0760
Patent Assignment
Reel/Frame 033095/0760

Assignment of Assignor's Interest

Recorded: 2014-06-13 Pages: 3
Assignors
WANG, CHIH-HAO
Executed: 2014-06-03
LIEN, WAI-YI
Executed: 2014-06-03
JU, SHI-NING
Executed: 2014-06-03
YANG, KAI-CHIEH
Executed: 2014-06-03
LAN, WEN-TING
Executed: 2014-06-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property (1)
Semiconductor Device and Method of Forming Vertical Structure
Patent: 9,755,033 →
Application: 14/303,744 →
Publication: US 2015/0364560