Patent Assignment
Reel/Frame 033097/0497
Assignment of Assignor's Interest
Recorded: 2014-06-13
Pages: 4
Assignor
KANG, MINSUNG
Executed: 2013-11-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnection Structures for Semiconductor Devices and Methods of Fabricating the Same