Patent Assignment
Reel/Frame 033098/0794
Assignment of Assignor's Interest
Recorded: 2014-06-13
Pages: 7
Assignors
YU, HAE-JUNG
Executed: 2014-05-23
BYUN, HAK-KYOON
Executed: 2014-05-23
NA, KYUNG-TAE
Executed: 2014-05-23
HAN, SEUNG-HUN
Executed: 2014-05-23
PARK, TAE-SUNG
Executed: 2014-05-23
YIM, CHOONG-BIN
Executed: 2014-05-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packaging Apparatus Formed from Semiconductor Package Including First and Second Solder Balls Having Different Heights