Patent Assignment
Reel/Frame 033107/0843
Assignment of Assignor's Interest
Recorded: 2014-06-16
Pages: 7
Assignors
LEE, WOON-SEOB
Executed: 2013-08-19
KANG, SIN-WOO
Executed: 2013-08-22
YUN, KI-YOUNG
Executed: 2013-08-20
CHO, SUNG-DONG
Executed: 2013-08-20
KIM, EUN-JI
Executed: 2013-08-20
PARK, YEONG-LYEOL
Executed: 2013-08-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including Through-Silicon via (Tsv) Contact Pads Electronically Insulated from a Substrate