Patent Assignment
Reel/Frame 033111/0195
Assignment of Assignor's Interest
Recorded: 2014-06-16
Pages: 2
Assignor
LIN, YAOJIAN
Executed: 2014-06-06
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming a Dampening Structure to Improve Board Level Reliability
Application:
14/305,560 →
Publication:
US 2015/0364430