IP Library › Assignment 033140/0197
Patent Assignment
Reel/Frame 033140/0197

Assignment of Assignor's Interest

Recorded: 2014-06-19 Pages: 3
Assignors
WENG, SSU-CHIANG
Executed: 2014-06-12
LEE, KUO-CHENG
Executed: 2014-06-12
JENG, CHI-CHERNG
Executed: 2014-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Structure of Dielectric Grid with a Metal Pillar for Semiconductor Device
Patent: 9,130,077 →
Application: 13/968,260 →
Publication: US 2015/0048467