Patent Assignment
Reel/Frame 033143/0997
Assignment of Assignor's Interest
Recorded: 2014-06-19
Pages: 3
Assignors
NAIK, MEHUL B.
Executed: 2014-04-16
NEMANI, SRINIVAS D.
Executed: 2014-04-16
KOSHIZAWA, TAKEHITO
Executed: 2014-04-18
REN, HE
Executed: 2014-04-16
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods for Forming Interconnection Structures in an Integrated Cluster System for Semicondcutor Applications