Patent Assignment
Reel/Frame 033150/0039
Assignment of Assignor's Interest
Recorded: 2014-06-20
Pages: 4
Assignors
YANG, TAI-I
Executed: 2014-06-12
WANG, YUNG-CHIH
Executed: 2014-06-12
CHUANG, CHENG-CHI
Executed: 2014-06-12
WU, CHIA-TIEN
Executed: 2014-06-12
LIN, TIEN-LU
Executed: 2014-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Combination Interconnect Structure and Methods of Forming Same