Patent Assignment
Reel/Frame 033159/0356
Assignment of Assignor's Interest
Recorded: 2014-06-23
Pages: 6
Assignors
YOON, JEONG-WON
Executed: 2014-06-18
LEE, BAIK-WOO
Executed: 2014-06-18
BOOH, SEONG-WOON
Executed: 2014-06-18
JEONG, CHANG-MO
Executed: 2014-06-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
SEMICONDUCTOR DEVICE PACKAGE INCLUDING BONDING LAYER HAVING Ag3Sn