Patent Assignment
Reel/Frame 033159/0918
Assignment of Assignor's Interest
Recorded: 2014-06-23
Pages: 12
Assignors
YOSHIMOTO, KAZUHIRO
Executed: 2014-05-15
SHIMOBEPPU, YUZO
Executed: 2014-06-06
TESHIROGI, KAZUO
Executed: 2014-03-24
SHINJO, YOSHIAKI
Executed: 2014-03-24
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.