Patent Assignment
Reel/Frame 033161/0613
Assignment of Assignor's Interest
Recorded: 2014-06-24
Pages: 12
Assignors
CHIEN, CHIN-CHENG
Executed: 2014-05-27
HSU, HSIN-KUO
Executed: 2014-05-27
LIU, CHIH-CHIEN
Executed: 2014-05-27
LIN, CHIN-FU
Executed: 2014-05-27
WU, CHUN-YUAN
Executed: 2014-05-27
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device Having Fin-Shaped Structure and Method for Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.