Patent Assignment
Reel/Frame 033162/0289
Assignment of Assignor's Interest
Recorded: 2014-06-24
Pages: 6
Assignors
TERUI, MAKOTO
Executed: 2014-06-17
KUNIEDA, MASATOSHI
Executed: 2014-06-17
SHIZUNO, YOSHINORI
Executed: 2014-06-17
II, ASUKA
Executed: 2014-06-18
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board and Method for Manufacturing the Same